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What are the precautions for processing epoxy resin boards?

1. Selection of cutting tools Conventional cutting: For plates with a thickness ≤ 5mm, a shearing machine or electric circular saw can be used, and a fine toothed saw blade (tooth pitch ≤ 3mm) should be used to reduce edge breakage. Thick plate cutting: When the thickness is greater than 5mm, it is recommended to use CNC milling machines, laser cutting machines, or waterjet cutting machines, especially suitable for processing complex shapes. Taboo: Avoid using ordinary manual steel saws, as it may cause rough cutting surfaces and internal micro cracks.

2. Cutting parameter control Speed and force: During mechanical cutting, the feed rate should be ≤ 50mm/min, and the laser cutting power should be controlled between 80-120W (adjusted according to thickness) to avoid high-temperature erosion of the edges of the sheet. Cooling measures: Compressed air or water-based coolant can be used to cool down during the cutting process to prevent local overheating and resin carbonization (carbonization will reduce insulation performance).

3. Edge processing Deburring: After cutting, it is necessary to use sandpaper (80-240 mesh) or milling cutters to polish the edges, ensuring that there are no sharp edges or burrs, and avoiding stress concentration that may cause cracking. Chamfering treatment: When used for load-bearing or stressed parts, it is recommended to process a 45 ° chamfer (depth 1-3mm) to enhance impact resistance.

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